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Fine Gauge Wire/Ribbon Bonding
Wire diameters: 17.5µm to 50µm (0.7 to 2.0 mil)
Ribbon: 6x35µm to 25x250µm (0.25x1.4 mil to 1x10 mil)
Wire and ribbon materials: aluminum, gold
Fine pitch is available
Bond area: 305mm x 410mm (12.3” x 16.14”)
Accuracy: 1um at 3 sigma
Speed: up to 6 wires/second
Loop Length: 70 µm up to 20 mm, depending on
wire diameter
Various loop form functions:
- -- Constant wire length
- -- Constant loop height
- -- Individual loop shapes

Heavy Gauge Wire/Ribbon Bonding
Wire diameters: 100µm to 500µm (4 to 20 mil)
Ribbon: 0.075x0.75mm to 0.4mm x 2mm
(3x30 mil to 16x80 mil)
Wire and ribbon materials: aluminum, copper
Bond area: 300mm x 500mm (13.8” x 19.7”)
Accuracy: 2µm at 3 sigma
Speed: up to 3 wires/sec

Gold Ball Bonding
Wire diameters: 15 to 50µm (0.6 to 2.0 mil)
Wire materials: gold
Fine pitch capability: 40µm
Minimum loop height: 100µm
(standard and worked loops)
Bond area: 56mm x 80mm
Accuracy: +/- 2.0µm
Speed: up to 15 bonds/second including
programmable looping
Looping capability: standard and worked
(BGA1-BGA3, Spider, J Wire, CSB)
Stand-off Stitch bond (SSB) capable
Stud bumping
Wire material: gold
Speed: Up to 30 bumps/second including
programmable smoothing

Hesse Mechatronics
Hesse Mechatronics
K&S IConn Gold Ball Bonder
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Test & Inspection