Microelectronic packaging is core to leveraging the functions and the performances of MEMS structures in a system and is critical to bridging the gap between component and environment for the intended application of a device. Heterogeneous packaging is often required to integrate dissimilar chips (ASIC, photonic, MEMS sensors, etc) into a single package. SMART Microsystems has the capability to accomplish this with mature technology processes for die attach, wire bonding and hermetic lid seal.
A MEMS pressure sensor measures pressure, typically of gases or liquids. It acts as a transducer which generates a signal (typically electrical) as a function of the pressure imposed. Pressure sensors can use piezoresistive or capacitive technologies. Capacitive MEMS are more sensitive than piezo-resistive MEMS, so are more suitable for biomedical applications such as catheters for blood pressure measurement. Other applications include automotive and military for control and monitoring fluid/gas flow, speed, water level, and altitude.
MEMS chemical sensors detect the presence, concentration, or quantity of a given analyte. Chemical sensors can be complex devices depending on the nature of the substance to be analyzed. These types of sensors are generally optimized for a particular application. Often times, these MEMS sensors may be a combination of microfluidics and a sensor that is functionalized to detect a specific substance. Applications range from low-cost portable devices that analyze fluid samples for bacteria during food processing to medical devices that analyze blood and other biological fluids.
Photonics includes optical sensing (of intensity of electromagnetic waves in the light spectrum), fiber optic sensors (where fiber optics perform as ‘intrinsic’ sensors), as well as sensors for imaging and illumination. Because of the nature of photonics, precision component placement is critical to the reliable performance of a device. Benefits of these devices include immunity to RFI/EMI. Applications include telecommunications, hi-resolution cameras, infrared detectors, medical imaging for lesions and wounds.